Laser Decapsulation
Starts at P4,200/sample (P3,300 student rate)
Decapsulation of packaged devices (such as integrated circuits (IC’s) and printed circuit boards (PCBs) exposes the internal components of the package. Laser Decapsulation uses laser to remove or etch out package material prior to using acid to lessen acid-etch time. Device failure analysis often relies on the selective etching of polymer encapsulants without compromising the integrity of the wire bonds and device layers.
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- Precise laser etching with optimizable parameters
- Capable of decapping IC packages
- Can etch different shapes
Applications
Inspection of the die, interconnects and other features typically examined during failure analysis
Description
Test Method |
Sample Preparation |
Sample Requirements |
Non-hermetic IC packages Maximum size: 10cm x 10cm IC package |
Test Limitations |
The laser may damage the desired part to analyze, needs test samples for parameter optimization |
Analysis Time required |
3-5 days *w/in 24 hours if urgent |