Surface Analysis

We perform analytical tests focusing on the outermost layer of solid materials to determine elemental, molecular, and chemical state of the surface.

© Ian Valiente Photography

Actual Images & Data of Analysis

The most vital part of every material lies mainly on its layer that is exposed to different external stimuli that dramatically affect its performance and properties. This makes materials highly susceptible to contamination and surface defects leading to failure. Time-of-flight Secondary Ion Mass Spectrometry (TOF-SIMS) is a surface-sensitive analytical method that performs both qualitative and quantitative analysis of elemental and molecular species on the sample. TOF-SIMS has a wide range of elemental detection, surveying almost all elements present in the sample in parts per million (ppm) or atomic mass unit (amu) range.In ADMATEL, our analysts are dedicated in providing accurate, fast, and reliable results using the following techniques for TOF-SIMS Analysis.

Quasi non-destructive surface analysis

Surface Spectrometry is the application of very low primary ion dose densities. It is a type of “quasi non-destructive surface analysis” wherein we can analyze elements and ions in the surface of our samples. 

 Elemental and molecular information
 ppm sensitivity (6-10 nm)
 Mass resolution > 10K
 Suited for insulators

Surface Imaging is the rastering of a finely focused ion beam over the surface mass resolved secondary ion images (chemical maps). 

Lateral distribution of elements and molecules
 Lateral resolution down to 60 nm
 Parallel mass detection
suited for insulators
 Sample consumption is very critical for high mass molecular ions.

Depth Profiling applies the dual-beam method and utilizes two plasma sources for sputtering and another for the analysis.

Interlaced Mode
Sputtering and analysis quasi-simultaneously
High data and high erosion rate
  Ideal for conducting samples

Non-Interlaced Mode
Sputtering and analysis are separated into different cycles
 Additional “pausing” cycle for charge compensation
Ideal for insulating samples

3D Analysis

3D Analysis combines imaging and depth profiling process producing successive ion images which can be further processed forming three-dimensional dataset

Actual Images & Data of Analysis

ADMATEL’s Focused Ion Beam – Field Emission Scanning Electron Microscope (FIB-FESEM) has the capability to observe and analyze broad-range of samples including insulative materials at magnification up to 1,000,000x. This type of imaging is ideal for obtaining topography, morphology, particle size and sub-micron defects using different modes of detection to fully visualize its physical characteristics.

SEM image of  pure Polylactic Acid (PLA) sample at 100x magnification 
SEM image of  pure Polylactic Acid (PLA) sample at 500x magnification 
Other Capabilities of ADMATEL's FIB-FESEM
Etched-image-of-Dr.-Jose-Rizal-on-Copper-substrate-using-ADMATEL's-Focused-Ion-Beam-(FIB)
Focused Ion Beam (FIB) Sectioning is used for site-specific material milling.  It is capable of producing small-scale, “polished-finish” cross-sections, free of curtaining and smearing.  It uses a focused beam of ions, in particular Ga+ ions, to remove material at a range of pre-defined currents.
 
Using ADMATEL’s Focused Ion Beam (FIB), here is an etched image of Dr. Jose Rizal on Copper substrate captured at 6,000x magnification with an approximate size of 16×21 microns.
 
This portrait is just three times the size of a red blood cell.

Get Free Technical Consultation

ADMATEL is open to serve you Monday-Friday, 8am-5pm. 
Call us at  (02) 8837-0461 or send us an email at services@admatel.com

Get Free Technical Consultation

We are open Monday-Friday, 8am-5pm. Call us at  (02) 8837-0461 or send us an email at services@admatel.com