P3,800/sample (P3,040 student rate)
Grinding is a sample preparation method that involves rubbing the sample on an abrasive-charged rotating wheel to flatten an irregular or damaged cut surface; remove damages obtained from previous process; remove a substantial amount of sample material to reach the desired plane for polishing, or level the mounting surface.
Polishing is a sample preparation method that uses a loose abrasive embedded in an appropriately lubricated supporting surface to achieve a smooth cross-section.
- Grit sizes: 60, 80, 120, 320, 400, 600, 800, 1000, 1200
- Can precisely adjust the rotation speed
Metallurgical Preparation, PCB verification, Layer Thickness, Multilayer Verification, Micro Sectioning, Micro Etching/ Chemical Etching
Any solid material that fits sample size limitation
Thick metal parts
Hard and densed materials