FIB-FESEM combines the most advanced scanning electron microscope and focus ion beam technologies with innovative gas etching chemistries and detectors to provide high resolution imaging, fast milling, and site-specific sample preparation down to nanoscale level.


  • Defect Analysis
  • Failure Analysis
  • TEM Lamella Preparation
  • Metrology at Nanoscale
  • Site Specific Sample Preparation
  • STEM Analysis
  • EDS Analysis
  • Cross-sectioning
  • Device Modification 
  • High Resolution Imaging

Site-Specific Sample Preparation Using FIB


FEI Helios Nanolab 600i


Tuesday, 20 August 2019
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